Adaptronics Secures €3.15M to Scale Electro-Adhesive Gripper Tech for Industry and Space

Adaptronics, a deeptech startup developing next-generation electro-adhesive grippers for industrial automation and space applications, has raised €3.15 million. The round was led by 360 Capital, with participation from Galaxia—an aerospace tech transfer hub backed by CDP Venture Capital’s Tech Transfer fund and Obloo Ventures, which also supported the company’s 2023 pre-seed.

Spun out of the University of Bologna in 2022 by Lorenzo Agostini (CEO), Camilla Conti (COO), and Rocco Vertechy (R&D Lead), Adaptronics is advancing how robots grasp and manipulate objects. Its proprietary EAAL (Electro-Active Adhesive Layer) generates controllable adhesion based on electrostatic forces, allowing robots to grip diverse materials and shapes with high precision—while using up to 1,000x less energy than conventional solutions and activating or releasing in under 10 milliseconds.

The technology integrates tactile sensing to enable gentle, accurate handling without the complexity of pneumatic, magnetic, or mechanical gripping systems. A modular design separates the control module from replaceable gripping units, reducing maintenance and operational costs.

The new funding will support facility expansion, establishment of a pilot production line, and accelerated European market growth, marking a significant milestone in the company’s commercialization roadmap.